NaMiFab - Core Facility for Nano- and Microfabrication

Expertise

NaMiFab has the knowhow and infrastructure for designing, realizing and inspecting nano- and microsystems of very diverse shape, dimensions and complexity. We can do small services or exploratory projects, which can lead to larger research projects. An overview of the available expertise is listed below. Please contact us for further information.

Nano- and microfabrication technologies

Photolitography (pattern definition)

  • Photomask alignment and exposure (resolution down to 800nm)
  • Laser direct imaging (resolution down to 1μm)
  • Electron beam lithography (resolution down to 10nm)

Layer deposition

  • Spin coating
  • Plasma deposition
  • Sputter deposition

  • Electron beam evaporation

  • Thermal evaporation for deposition of organic layers
  • Atomic layer deposition (aluminium oxide)

Etching

  • Development, etch and strip line for flexible PCBs
  • Plasma etching (RIE, ICP, Oxygen)
  • HF-vapor etching

Material structuring

  • Laser structuring, cutting, drilling and welding on a variety of substrates
  • Microinjection moulding of small parts (<1g)
  • Dicing, lapping, polishing
  • Lamination, imprinting
  • Vacuum forming

Assembly

  • Die and flip-chip bonding (± 5μm accuracy)
  • Accurate (± 1μm) placement of chips and toher 3D structures
  • Micro-Transfer-printing (μTP)
  • Wafer bonding
  • Automated needle dispensing
  • Screenprinting
  • Reflow soldering
  • Aerosol-jet printing (metallic conductive inks)
  • Liquid crystal device assembly

Sample inspection

Microscopy

  • Optical microscopy (mm to µm size features)
  • Electron microscopy: SEM,FEG-SEM with in situ FIB
    • Au & C coating for SEM

Profilometry

  • 3D optical profilometry
  • Step height measurement (stylus 2.5 or 12.5μm)

Cross sectioning

  • Sample molding in resins followed by grinding and polishing
  • Ion beam polishing
  • FIB local cross sections integrated in a FEG SEM instrument

Surface analysis

  • Contact angle
  • Solderability testing
  • Critical Cleanliness Control testing

Material analysis

  • SEM-EDS

Reliability testing and failure analysis

Mechanical testing

  • Peel test (90° & 180°)
  • Component shear and pull testing
  • Stress/strain measurements
  • Cyclic endurance testing
  • Standardized washing tests

Climate chamber testing

  • Temperature storage (37 – 200 °C)
  • Temperature-humidity testing (10 – 95 °C, 10 – 98 % RH)
  • Temperature cycling (-70 °C to 180 °C) with in-situ resistance measurement

Electrical testing

DC measurements

  • Contact resistance measurement using four-point probe station
  • Sheet resistance measurement using four-point probe station
  • Component characterization (I/V curve, leakage current)
  • Surface insulation Resistance (linked to climate chamber)

AC measurements

  • Electronic circuit analysis
  • Impedance and network analysis
  • Dielectric withstanding voltage testing up to 6 kV (Chroma 19052)